Multilayer Structure Design Lightweight Heat Dissipation Housing for Automotive Headlamp Drivers Electronic Device Thermal Management Solution

This heat dissipation housing utilizes an innovative multilayer structure design, specifically developed for efficient thermal management in automotive headlamp drivers and other electronic devices. By combining the advantages of different materials, such as a PBT-GF15 connection part and a graphite nylon heat dissipation part, it achieves exceptional heat dissipation performance while significantly reducing product weight and cost1. The integrated aluminum sheet inside the housing not only enhances heat dissipation but also provides electronic signal shielding to ensure stable device operation.

• Efficient Heat Dissipation: The multilayer structure design incorporates high thermal conductivity materials (like graphite nylon and aluminum sheets) to rapidly conduct and disperse heat, ensuring electronic components operate within safe temperatures1.
• Lightweight Design: Significantly lighter than traditional die-cast aluminum alloy housings, facilitating installation and reducing overall system weight1.
• Cost-Effective: Material combination and structural design reduce production costs while maintaining performance1.
• Signal Shielding: The built-in aluminum sheet provides electromagnetic interference (EMI) shielding, protecting electronic devices from interference1.
• High Durability: Material selection focuses on corrosion resistance and mechanical strength to adapt to various environmental conditions25.
• Customization Flexibility: Dimensions, materials, and structure can be adjusted according to customer requirements for specific application scenarios5.

• Automotive Electronics: Such as automotive headlamp drivers1.
• Consumer Electronics: Smartphones, tablets, LED lighting equipment5.
• Communication Equipment: 5G base stations, network filters, terminal boxes25.
• Industrial Electronics: Sensors, instrument manufacturing, terminal boxes2.
• High-Performance Computing: CPU coolers, power supply units10.

We offer comprehensive customization solutions to meet specific customer needs:

• Dimensional Customization: Precise design based on customer device dimensions.
• Material Selection: A variety of thermal conductive and structural materials are available, including aluminum alloy, magnesium alloy, engineering plastics (e.g., PC, ABS, PPS), and composite materials (e.g., CFRP)5.
• Structural Design: Options include multilayer structures, integrated heat dissipation fins8, and micro-pump liquid cooling systems7 for enhanced heat dissipation.
• Surface Finish & Color: Various surface treatments and color options are available to meet aesthetic and branding needs2.
• Functional Add-ons: Such as enhanced EMI shielding, improved waterproof and dustproof ratings (e.g., IP67)15.

• Technical Consultation: Our engineering team provides professional technical support and material selection advice5.
• Sample Testing: We support providing samples for performance and compatibility testing.
• After-Sales Guarantee: We offer quality assurance and after-sales service to ensure customer satisfaction.
• Global Delivery: We support worldwide shipping with flexible delivery options2.